Category | Interconnects |
Manufacturer | TE Connectivity |
Type | LGA |
Number of Positions or Pins (Grid) | 2011 (47 x 58) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
Contact Material - Mating | Copper Alloy |
Features | Open Frame |
Termination | Solder |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 30.0µin (0.76µm) |
Contact Material - Post | Copper Alloy |
Housing Material | Thermoplastic |
Material Flammability Rating | UL94 V-0 |
Mounting Type | Surface Mount |